Automotive Magazine now available from Electronics Update
Just click on the image and you will be redirected to our Automotive Magazine. The Automotive Market has seen a great deal of change in the past years. The unstoppable rise of electric vehicles as a disruptive propulsion technology, replacing…
Latest Electronics News
Molex High-Power Cable Assemblies
Molex High-Power Cable Assemblies offer discrete wires or overmolded cables from 12AWG to 6AWG and…
Infineon joins EEBus Initiative e.V., supporting the standardisation for energy management systems
One key way to address the global trends of an increasing share of volatile renewable…
European semiconductor manufacturer SweGaN secures 12 million Euro investment
SweGaN AB, manufacturer of custom-made Gallium Nitride on Silicon Carbide (GaN-on-SiC) epitaxial wafers for an extensive range…
Connector Raw Material Costs Increased 6% In 2Q22
Connector raw material costs increased 6% in 2Q22 according to Bishop Associates report. Inflation has…
Low profile 5G and 4G LTE antennas are slim for limited spaces
Two low profile antennas have a low height of just 1.6mm. This makes the Alcor…
X- and W-type Hyperfast rectifiers are in isolated package
Fred Pt Gen 5 600V Hyperfast rectifiers are available in isolated packages from Vishay Intertechnology.…
Automotive MEMS accelerometer enhances vehicle acoustics
A vibration sensor, the AIS25BA, is optimised for sensing road noise and related vibration to…
Atlas Copco acquired a distributor of compressors in New Mexico, USA
Atlas Copco has acquired the operating assets of the compressor business of Mesa Equipment &…
Cybord: Electronic Component Traceability
Counterfeit electronics is a multibillion-dollar industry worldwide. The challenge is finding them, and this is…
Research Bits: Oct. 4
2D electrode for ultra-thin semiconductors Researchers from the Korea Institute of Science and Technology (KIST),…
Technical Paper Roundup: Oct. 4
New technical papers added to Semiconductor Engineering’s library this week. Technical Paper Research Organizations RISC-Vlim,…
Extending The Benefits Of UVM To Include AMS: An Update On Accellera’s UVM-AMS Standard Development
By Tom Fitzpatrick and Peter Grove SoC teams can be divided up into design and…
Samsung aims to triple advanced IC production in five years
Earlier today Samsung said it aims to triple its foundry business for advanced ICs by…
EU chip plan would cost €500m, says NXP CEO
The EU will need ten times more than its budget if it wants to get…
$99bn spend on fab equipment this year
Global fab equipment spending for front-end facilities is expected to increase approximately 9% year-over-year (YOY)…
Viewpoint: The pressures on Integrated Circuit designers
“How do Integrated Circuit designers cope with increasing demands while maintaining a good work-life balance?”…
DASA funded competition winners get to grips with telexistence technology
The UK government’s DASA (Defence and Security Accelerator) has awarded £1.3 million in funding for…
US Patent Office looks for public input
The United States Patent and Trademark Office (USPTO) has asked for comments on initiatives directed…
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