Latest Electronics News
Harvester IC matches solar cells to batteries automatically
Nexperia has created an energy harvesting IC for photovoltaic cells up to around 1mW, that…
KAMIC Group Acquires Wound Components Specialist AGW Electronics
KAMIC Group acquires AGW Electronics, a leading British manufacturer of customised wound components. KAMIC Group…
Infineon extends AURIX TC3xx MCAL by adding support for AUTOSARv4.4.0 to the existing AUTOSARv4.2.2 MCAL
Infineon Technologies extends its AURIX TC3xx MCAL by adding support for AUTOSARv4.4.0 to the existing…
Week In Review: Semiconductor Manufacturing, Test
Japanese and American trade officials announced a joint roadmap for cooperation in strengthening global semiconductor…
Week In Review: Auto, Security, Pervasive Computing
AI predictions and announcements filled the news this week, including a statement from the Center…
Week In Review: Design, Low Power
Arm debuted its latest platform for mobile computing. Arm Total Compute Solutions 2023 adds the…
Raspberry Pi anticipates consistent million unit quarters
Raspberry Pi is on the way to consistent shipments of a million units a month.…
Surpluses, shortages and losses
It is a market like no other – massive surpluses in some product lines, shortages,…
Vitesco and onsemi hook up on SiC
Vitesco Technologies and onsemi have signed a long-term supply agreement for SiC products. Vitesco is…
Infineon and SPIL collaborate on verification workflow for fan-out packaging
Siemens Digital Industries Software and OSAT specialist Siliconware Precision Industries (SPIL) have implemented an IC…
Iceye introduces Dwell capability for SAR satellite imagery
Iceye, the Finnish satellite imagery specialist, has introduced a new imaging mode, dubbed “Dwell”, for…
VTI Instruments SMX Series of PXIe switches now available from element14
SMX Series of PXIe switches provides superior signal integrity and test reliability in efficient, high-density…
Leclanché & Medha collaborate for Railroad & Commercial Vehicle Markets
Medha Group and Leclanché SA have agreed to jointly market their technologies in the Railroad and…
Comparing Analog and Digital SRAM In-Memory Computing Architectures (KU Leuven)
A technical paper titled “Benchmarking and modeling of analog and digital SRAM in-memory computing architectures”…
Ubiquitous Gamers
Gamers play anywhere, on anything According to Statista Consumer Insights, Americans play games on a…
Issues and Opportunities in Using LLMs for Hardware Design
A technical paper titled “Chip-Chat: Challenges and Opportunities in Conversational Hardware Design” was published by…
Rowhammer Vulnerability Of A HBM2 DRAM Chip
A new technical paper titled “An Experimental Analysis of RowHammer in HBM2 DRAM Chips” was…
Semtech Announces New President and CEO
Semtech Corporation today announced that its board of directors has appointed Paul H. Pickle as…
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