Semiconductor

Americas’ Chip Suppliers Continue to Dominate R&D Spending thumbnail

Americas’ Chip Suppliers Continue to Dominate R&D Spending

Despite political and national security concerns about U.S. domestic semiconductor production, American companies continue to account for more than half of the global chip industry’s total spending on research and development, according to the latest annual analysis of R&D expenditures by IC Insights.  About 56% of worldwide semiconductor industry R&D spending in 2021 was by …

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Improving Image Sensors for Machine Vision thumbnail

Improving Image Sensors for Machine Vision

Image sensors measure light intensity, but angle, spectrum, and other aspects of light must also be extracted to significantly advance machine vision. In Applied Physics Letters, published by AIP Publishing, researchers at the University of Wisconsin-Madison, Washington University in St. Louis, and OmniVision Technologies highlight the latest nanostructured components integrated on image sensor chips that …

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SEMICON Taiwan 2022 to Highlight Auto Chips, Advanced Manufacturing, Heterogeneous Integration and Sustainability thumbnail

SEMICON Taiwan 2022 to Highlight Auto Chips, Advanced Manufacturing, Heterogeneous Integration and Sustainability

With Taiwan forecast to rank as a top buyer of chipmaking equipment, the stage is set for SEMICON Taiwan 2022 as companies from across the electronics design and manufacturing supply chain gather for insights into the latest trends, developments and innovations driving industry growth. Registration is open for the exhibition and conferences, September 14-16, 2022 …

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Micron Ships World’s First 232-Layer NAND, Extends Technology Leadership thumbnail

Micron Ships World’s First 232-Layer NAND, Extends Technology Leadership

Micron Technology, Inc. (Nasdaq: MU), today announced that it has begun volume production of the world’s first 232-layer NAND, built with industry-leading innovations to drive unprecedented performance for storage solutions. It features the industry’s highest areal density and delivers higher capacity and improved energy efficiency over previous generations of Micron NAND, to enable best-in-class support …

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Technical Paper Round-Up: July 26 thumbnail

Technical Paper Round-Up: July 26

New technical papers added to Semiconductor Engineering’s library this week. Technical Paper Research Organizations Integrated Silicon Microfluidic Cooling of a High-Power Overclocked CPU for Efficient Thermal Management Georgia Tech and Microsoft High ambipolar mobility in cubic boron arsenide MIT, University of Houston, UT Austin and others Interfacial Delamination at Multilayer Thin Films in Semiconductor Devices MIT, Yonsei …

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Research Bits: July 26 thumbnail

Research Bits: July 26

Photonic computing with polarization Researchers at the University of Oxford and University of Exeter developed a method that uses the polarization of light to maximize information storage density and computing performance using nanowires. The researchers note that different polarizations of light do not interact with each other, allowing each to be used as an independent …

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Monolithic Microfluidic Cooling on a Functional CPU Running Real-World Benchmarks thumbnail

Monolithic Microfluidic Cooling on a Functional CPU Running Real-World Benchmarks

New technical paper titled “Integrated Silicon Microfluidic Cooling of a High-Power Overclocked CPU for Efficient Thermal Management” is published by researchers at Georgia Tech and Microsoft. According to the abstract: “In this work, we use micropin-fins etched directly on the back of an Intel Core i7-8700K CPU and overclocked it to dissipate up to 215W …

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