Electronic System Design (ESD) industry revenue increased 14.4% from $3,031.5 million in Q4 2020 to $3,468.2 million in Q4 2021, the ESD Alliance, a SEMI Technology Community, announced today in its latest Electronic Design Market Data (EDMD) report. The four-quarter moving average, which compares the most recent four quarters to the prior four, rose 15.8%. …
Electronic System Design (ESD) industry revenue increased 14.4% from $3.03 billion in Q4 2020 to $3.5 billion in Q4 2021, according to the latest Electronic Design Market Data (EDMD) report by ESD Alliance, a SEMI Technology Community. Walden C. Rhines, executive sponsor of the SEMI Electronic Design Market Data report noted, “The industry continued to …
Electronic System Design Revenue Up 14.4% Y/Y in Q4 2021 Read More »
A Monash University-led research team has discovered that a structure comprising an ultra-thin topological insulator sandwiched between two 2D ferromagnetic insulators becomes a large-bandgap quantum anomalous Hall insulator.
Semiconductor manufacturing, test, and inspection equipment startups did well in March. Investors funded a wide variety of equipment companies, including test equipment, materials handling, and those that make parts and components. In the manufacturing space, several companies developing manufacturing execution systems received funding, as well as a startup trying to prevent counterfeit parts from making …
New technical paper from Hanyang University and University of Texas at Dallas. Abstract “A pellicle is a thin membrane structure that protects an extreme ultraviolet (EUV) mask from contamination during the exposure process. However, its limited transmittance induces unwanted heating owing to the absorption of EUV photons. The rupture of the EUV pellicle can be …
Abstract “Copper wire bonding has got attracted attention over gold wire bonding due to its lower cost. However, despite many unique aspects and properties of copper wire bonding, corrosion of copper wire bonding has become a point of interest as it leads to the failure of semiconductor packages. Current and future trends and development in …
New research paper from Politecnico di Torino. Abstract: “This paper describes a novel approach to assess detection mechanisms and their diagnostic coverage, implemented using embedded software, designed to identify random hardware failures affecting digital components. In the literature, many proposals adopting fault injection methods are available, with most of them focusing on transient faults and …
New academic paper from Institute for Software and Systems Engineering, Technische Universität Clausthal, Germany. Abstract “A well-known challenge in the development of safety-critical systems in vehicles today is that reliability and safety assessment should be rigorously addressed and monitored. As a matter of fact, most safety problems caused by system failures can lead to serious …
New academic paper out of USC Viterbi School of Engineering: Abstract “Ferroelectric materials exhibit a rich range of complex polar topologies, but their study under far-from-equilibrium optical excitation has been largely unexplored because of the difficulty in modeling the multiple spatiotemporal scales involved quantum-mechanically. To study optical excitation at spatiotemporal scales where these topologies emerge, …
New academic paper from UK’s Leeds Beckett University. Abstract “The prevalent demand for remote data sharing and connectivity has catalysed the development of many wireless network technologies. However, low-power and low-rate wireless network technologies have emerged as the preferred choice (due to cheap procurement and maintenance cost, efficiency, and adaptability). Currently, these groups of wireless …
Brokerage System for Integration of LrWPAN Technologies Read More »