Semiconductor

Verilog HDL And Its Ancestors And Descendants thumbnail

This paper describes the history of the Verilog hardware description language (HDL), including its influential predecessors and successors. Since its creation in 1984 and first sale in 1985, Verilog has completely revolu- tionized the design of hardware. Verilog enabled the development and wide acceptance of logic synthesis. For large-scale digital logic design, previous schematic-based techniques …

Verilog HDL And Its Ancestors And Descendants Read More »

Using A System Technology Co-Optimization (STCO) Approach For 2.5/3D Heterogeneous Semiconductor Integration thumbnail

With the economics of transistor scaling no longer universally applicable, the industry is turning to innovative packaging technologies to support system scaling demands and achieve lower system cost. This has led to the system technology co-optimization (STCO) concept, where a SoC type system is disaggregated, or partitioned, into smaller modules (also known as chiplets) that …

Using A System Technology Co-Optimization (STCO) Approach For 2.5/3D Heterogeneous Semiconductor Integration Read More »

Blog Review: June 23 thumbnail

Synopsys’ Manuel Mota shows how splitting SoCs into smaller dies for advanced packaging and using die-to-die interfaces to enable high bandwidth, low latency, and low power connectivity can benefit hyperscale data centers. Siemens EDA’s Chris Spear explains the relationship between classes and objects in SystemVerilog with a handy visualization and notes the difference between SystemVerilog …

Blog Review: June 23 Read More »

IP Solutions For A Data-Centric World thumbnail

We’re in an era of sizeable growth in data and compute demand, along with increasing global data traffic. As a result, high-performance computing, data communications, networking, and storage systems are taking center stage in many application areas, driven by newer applications such as analytics, artificial intelligence (AI), genomics, and simulation-intensive workloads. Power efficiency, high performance …

IP Solutions For A Data-Centric World Read More »

Bumps Vs. Hybrid Bonding For Advanced Packaging thumbnail

Advanced packaging continues to gain steam, but now customers must decide whether to design their next high-end packages using existing interconnect schemes or move to a next-generation, higher-density technology called copper hybrid bonding. The decision is far from simple, and in some cases both technologies may be used. Each technology adds new capabilities in next-generation …

Bumps Vs. Hybrid Bonding For Advanced Packaging Read More »

Jim Hogan and Edward McCluskey Named Honorees of ESD Alliance and IEEE CEDA Phil Kaufman Hall of Fame thumbnail

Jim Hogan, executive, angel investor and board member, and Stanford University Professor Edward J. McCluskey today became the first posthumous honorees of a new honor acknowledging their significant and noteworthy contributions to the electronic system design industry. The Kaufman Hall of Fame, co-sponsored by the Electronic System Design (ESD) Alliance and the IEEE Council on Electronic Design Automation (CEDA), …

Jim Hogan and Edward McCluskey Named Honorees of ESD Alliance and IEEE CEDA Phil Kaufman Hall of Fame Read More »

Wafer Supply Constrained Through 2024 Likely thumbnail

TECHCET—the electronic materials advisory firm providing business and technology information— announced that the wafer supply will remain constrained into and possibly through 2024. With 300 mm wafer capacity tightening, it will likely remain tight in subsequent years unless greenfield capacity is brought online. Based on current forecasts, 300 mm prime wafer demand will be at …

Wafer Supply Constrained Through 2024 Likely Read More »

NVIDIA Announces Instant AI Infrastructure for Enterprises thumbnail

NVIDIA today unveiled NVIDIA AI LaunchPad, a comprehensive program delivered through hybrid-cloud providers that gives enterprises immediate access to NVIDIA-powered infrastructure and software to streamline the entire AI lifecycle. Digital infrastructure leader Equinix will be the first in the AI LaunchPad program, providing NVIDIA-powered hybrid-cloud solutions globally on Platform Equinix®. The Equinix infrastructure deploys in minutes, …

NVIDIA Announces Instant AI Infrastructure for Enterprises Read More »